High Vacuum And Coating System Specialists

Lake Industrial Estate
EX21 5SP

Tel  +44(0)1409 281853
Fax +44(0)1409 281852

New Product The Wordentec R N D
Featuring clean pumping technology the RND was designed to address cutting edge prototype and research applications. The RND feaatures a high quality, fully helium leak tested chamber . The system design maximises the space and configuration options available.
  • 400mm Stainless Steel Chamber
  • Industry Standard Clean Pump (cryo or turbo
  • Robust PLC Control
  • Removable chamber Liners
Options Include
  • Pumped Substrate load Lock
  • Substrate Heating
  • Substrate Rotation and Bias
  • Shutters
A compact and versatile vacuum coating system for R+D thin film applications
Sequential Themal Evaporation
Source Specification
Source 1Thermal
Source 2 Thermal
Power Supply1.8 KVA
Source ControllerWordentec PLC
Chamber Size L x W x H400mm x 400mm x 500mm
Substrate Carrier 360mm
Source to Substrate 350mm
Wafer Guide
Maximum number 4" (101.6mm) wafers5
Maximum number 5" (127.0mm) wafers5
Maximum number 6" (152.4mm) wafers3
Maximum number 8" (203.2mm) wafers1
High Vacuum PumpTurbopump
Pump down time15 minutes
Ultimate Pressure5.5 x10E-07
Maximum Temperature600 degrees
Chamber Cooling5 channel