Vacuum ovens are used for a variety of applications, including:
Drying delicate materials. Vacuum ovens can be used to dry materials that are sensitive to heat or oxygen,
such as biological samples, electronic components, and pharmaceutical products.
The low pressure in the chamber helps to remove moisture and volatile substances at much lower temperatures,
which prevents the materials from being damaged.
Outgassing materials. Vacuum ovens can be used to outgas materials, which means removing gases and volatile substances from them.
This is often done to prepare materials for use in vacuum environments, such as space or high-altitude applications.
Annealing materials. Vacuum ovens can be used to anneal materials, which means heating them to a specific temperature and then allowing them to cool slowly.
This process can improve the properties of materials, such as their strength, toughness, and electrical conductivity.
Wordentec vacuum ovens can be supplied with or without a turbomolecular pump. In its standard form the oven is fitted with a scroll pump
and can reach pressures as low as 5.0E-03 mbar.
Each shelf is heated with a separate element and PID controller that controls the shelf temperature to within 1°C
The maximum bake temperature is 450°C, and processes can contain any number of setpoints, ramp rates and dwell periods.
The pump down, bake and vent are controlled by a PLC based system to ensure process consistency, however the oven can be easily controlled using its manual control interface.
There is the option of venting to nitrogen or other inert gasses, the same inlet can also be used for a controlled pump and purge sequence.
Datalogging and process information can be stored locally and downloaded, or viewed online using its network interface.
